||United States : Qualcomm Technologies Announces RF Front-End Design Wins with Google, HTC, LG, Samsung and Sony Mobile
||Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated , announces radio frequency front-end (RFFE) design wins with a host of leading original equipment manufacturers (OEM), including Google, HTC, LG, Samsung and Sony Mobile. Qualcomm Technologies rich portfolio of RF front-end platform solutions is designed to help OEMs deliver advanced mobile devices at scale and with accelerated time to commercialization. The strength of the Companys design pipeline supports the value of the Companys modem-to-antenna solutions. Qualcomm Technologies is the first technology provider to produce the hardware and software needed to deliver a comprehensive modem-to-antenna system solution to OEMs, which includes new QPM26xx series gallium arsenide (GaAs)-based power amplifier modules including duplexers (PAMiDs), envelope tracker, antenna tuners, antenna switches and discrete and integrated filter modules.
Only Qualcomm Technologies is delivering robust end-to-end RFFE and modem solutions tailored for each tier of devices to address the increasingly complex RF demands of current networks in Gigabit LTE and beyond. This is proven out by our extremely strong design pipeline for RF front-end, said Cristiano Amon, president, Qualcomm Incorporated. Our advanced RF solutions deliver superior connectivity performance and flexibility in form factor design, and were thrilled to work alongside customers like Google, HTC, LG, Samsung and Sony Mobile to help deliver this combination of form and function to consumers around the world. "With Qualcomm Technologies comprehensive modem-to-antenna system solution and integrated modem software, HTC is able to build feature-leading premium smartphones with advanced LTE connectivity, said Adrian Tung, senior vice president, HTC. "Consumers rely heavily on robust, consistent cellular performance, and Qualcomm Technologies end-to-end solution accelerates our time to commercialization while simplifying our supply chain."
LG gains distinct advantages in performance and sophisticated smartphone design by using Qualcomm Technologies tightly integrated modem and RF front-end offerings, said Min Kyung-ho, head of hardware platform, LG Electronics Mobile Communications Company. This has allowed us to build global smartphones while accelerating the development of 600 MHz support and HPUE with Qualcomm Technologies platforms optimized for envelope tracking, enabling our products to deliver super-fast data speeds, high quality voice services and reliable voice connections to our customers around the globe. Consumers around the globe demand powerful signal strength, even in the most difficult conditions. Samsung can deliver this thanks to Qualcomm Technologies end-to-end integrated modem and RF offerings, said Yeonjeong Kim, vice president of R&D, Samsungs Mobile Communications Business. Samsung is proud to create the advanced mobile devices available today with industry-leading LTE connectivity performance, made possible with Qualcomm Technologies comprehensive advanced RF front-end solutions.
Sony Mobile is utilizing Qualcomm Technologies system-level approach to RF front-end design to achieve major performance enhancements through tight modem and RF front-end interaction, which allows for the superior signal performance in the sleek form factors our consumers demand, said Izumi Kawanishi, Director, executive vice president, product business group, Sony Mobile Communications Inc. Additionally, our devices can achieve lower power consumption with envelope tracking, and the reduced design and test cycles help us deliver extremely high performing products in less time to commercialization. RF front-end is critical to the mobile experiences end-users expect from their devices and for enhancing future advancements across the mobile industry. Complementing its leading modem technology for next generation mobile devices, Qualcomm Technologies RF front-end portfolio delivers industry-leading mobile solutions that support groundbreaking technologies, such as Gigabit LTE, 4x4 MIMO and LTE Advanced, and is crucial to the evolution and commercialization of 5G technologies in 2019.
Qualcomm Technologies strong RF front-end design pipeline represents the culmination of recent steps in the Companys business strategy to develop and commercialize comprehensive mobile solutions from the digital modem to the antenna. Following the February 2017 completion of the RF360 Holdings Singapore PTE. Ltd., joint venture between Qualcomm Incorporated and TDK Corporation, Qualcomm Technologies introduced a suite of comprehensive RF front-end products that added new and significant capabilities to its portfolio. These included its first gallium arsenide (GaAs) power amplifier modules, the next-generation Qualcomm TruSignal antenna tuning solution, premium-tier PAMiD modules, comprehensive 600 MHz band (B71) support with a low-band PAMiD module, TC- surface acoustic wave (SAW) diversity receives filter and duplexer, the extension of extending B71 capability to its GaAs MMPA products and a B71-optimized aperture tuner. Additionally, at a November 2017 groundbreaking event in Singapore, RF360 Holdings conducted a signing ceremony to expand production capacity at its key manufacturing production site dedicated to manufacturing RF front-end SAW structured wafers, as well as state-of-the-art Thin Film Acoustic With its comprehensive core of RF front-end technologies and the ability to provide the ecosystem a truly comprehensive solution, Qualcomm Technologies is uniquely positioned to address the rapidly expanding complexity and challenges of 4G and 5G.
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